Leveraging Artificial Intelligence in In-System Test: A New Paradigm for Predictive and Adaptive Chip Validation

Pandey, Jayesh Kumar (2025) Leveraging Artificial Intelligence in In-System Test: A New Paradigm for Predictive and Adaptive Chip Validation. World Journal of Advanced Engineering Technology and Sciences, 15 (3). pp. 2234-2245. ISSN 2582-8266

The exponential growth in complexity of modern system-on-chip (SoC) designs, characterized by heterogeneous integration of billions of transistors across diverse functional blocks, has fundamentally transformed semiconductor validation requirements. As these sophisticated chips increasingly power mission-critical applications—from autonomous transportation systems to medical devices and critical infrastructure—traditional test methodologies focused primarily on manufacturing defects have proven inadequate for ensuring sustained reliability throughout operational lifetimes. In-System Test (IST) mechanisms embedded within semiconductor devices offer a promising solution by extending validation capabilities beyond manufacturing into deployment environments, enabling continuous monitoring and diagnostics throughout the product lifecycle. However, conventional IST implementations remain predominantly static and pattern-based, executing predetermined test sequences that cannot adapt to the dynamic operational conditions, workload variations, and evolving stress patterns encountered in real-world environments. This architectural limitation creates a critical gap between test coverage and actual reliability requirements, particularly for advanced process nodes where subtle degradation mechanisms may manifest uniquely based on specific usage conditions. This article explores the transformative potential of Artificial Intelligence (AI) in addressing these limitations by augmenting traditional IST frameworks with adaptive, learning-enabled capabilities. Machine learning techniques can enable predictive fault detection by identifying subtle precursors to potential failures before they manifest as functional errors, dynamic test scheduling that optimizes validation coverage based on operational conditions, and intelligent analytics that accelerate root cause identification for complex failure modes. The integration of these capabilities creates a fundamental shift from reactive to proactive reliability management, enabling semiconductor devices to continuously adapt their validation strategies based on actual operational experience. The article provides a framework for implementing AI-augmented IST, detailing the architectural requirements, data collection infrastructure, edge processing considerations, and secure update mechanisms necessary for practical deployment. The discussion examines potential AI models and implementation strategies across diverse application domains, from autonomous vehicles to data center processors, medical devices, and consumer electronics, highlighting domain-specific considerations and optimization techniques. Finally, the article examines the significant challenges that must be addressed to realize the full potential of AI-augmented IST, including model efficiency requirements for resource-constrained environments, training data limitations for reliability applications, security and privacy considerations for distributed learning systems, and standardization needs for cross-platform interoperability. By mapping both the opportunities and obstacles in this emerging field, the article provides a roadmap for developing intelligent test frameworks for next-generation semiconductor systems.