Sonocrystallization: Advancing CMP slurry technology for next-generation semiconductor manufacturing

Krishnamurthy, Sugirtha (2025) Sonocrystallization: Advancing CMP slurry technology for next-generation semiconductor manufacturing. World Journal of Advanced Engineering Technology and Sciences, 15 (1). pp. 935-941. ISSN 2582-8266

Sonocrystallization represents a transformative advancement in Chemical Mechanical Planarization (CMP) slurry technology for semiconductor manufacturing. This innovative technique harnesses ultrasonic energy to control crystal nucleation and growth during slurry particle formation, enabling unprecedented precision in particle size distribution and morphology. The process addresses critical challenges in advanced node processing through enhanced control over particle characteristics, resulting in improved planarization performance and reduced surface defects. Sonocrystallization-based slurries demonstrate superior stability, consistency, and performance metrics across various semiconductor materials and structures. The technology's implementation has yielded significant improvements in within-wafer uniformity, removal rate consistency, and overall manufacturing efficiency while reducing environmental impact through decreased waste generation and improved resource utilization.